低温共烧Mg2Al4Si5O18/MgO-B2O3-SiO2玻璃陶瓷

被引：1

作者：

黄学敏

孙成礼

王铭剑

张树人

机构：

[1] 电子科技大学电子科学与工程学院

来源：

电子元件与材料 | 2020年 / 39卷 / 10期

关键词：

Mg2Al4Si5O18; MgO-B2O3-SiO2; LTCC; 玻璃陶瓷; 介电性能;

D O I：

10.14106/j.cnki.1001-2028.2020.0369

中图分类号：

TQ174.1 [基础理论];

学科分类号：

摘要：

为满足器件高度集成化、小型化、高频化需求,低介电常数且满足低温共烧（LTCC）技术应用的陶瓷基板材料具有重要研究价值。采用传统固相法制备Mg2Al4Si5O18/MgO-B2O3-SiO2 （MBS）玻璃陶瓷,研究了MBS玻璃含量对Mg2Al4Si5O18陶瓷性能的影响。利用XRD、SEM、DSC、密度测试仪、矢量网络分析仪、热膨胀分析仪分析了样品的烧结特性、物相组成、微观形貌、介电性能及热学性能。结果表明,添加质量分数为40%～50%的MBS玻璃可以成功将Mg2Al4Si5O18陶瓷的烧结温度从1430℃降至950℃左右。当MBS玻璃的质量分数为47.5%时,在950℃下烧结0.5 h,可得到满足LTCC技术用Mg2Al4Si5O18陶瓷基板材料:εr=5.1,tanδ=0.0023,热膨胀系数为6.6×10-6/℃。

引用

页码：42 / 46

页数：5

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