Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

被引：0

作者：

Yan-qiu Han

Li-hua Ben

Jin-jin Yao

Chun-jing Wu

机构：

[1] SchoolofMaterialsScienceandEngineering,UniversityofScienceandTechnologyBeijing

来源：

InternationalJournalofMineralsMetallurgyandMaterials | 2015年 / 22卷 / 01期

关键词：

composite materials; copper; aluminum; temperature; cooling rate; interfaces; diffusion bonding;

D O I：

暂无

中图分类号：

TB331 [金属复合材料];

学科分类号：

0805 ; 080502 ;

摘要：

Cu/Al composites are of vital importance in industrial applications because of their numerous advantages.The influence of bonding temperature and cooling rate on the microstructure and morphology of Cu/Al composites was investigated in this paper.The interfacial morphology and constituent phases at the Cu/Al interface were analyzed by optical microscopy and field-emission scanning electron microscopy equipped with energy-dispersive X-ray spectroscopy.The results indicate that effective Cu-Al bonding requires a higher bonding temperature to facilitate interdiffusion between the two metals.The microstructural characteristics are associated with various bonding temperatures,which impact the driving force of interdiffusion.It is observed that cooling rate exerts a significant influence on the morphology and amount of the intermetallic compounds at the interfacial region.Meanwhile,microhardness measurements show that hardness varies with the bonding temperature and rate of cooling.

引用

页码：94 / 101

页数：8

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