EffectoftheFourthElementonBondingofSiliconNitrideCeramicswithY2O3-Al2O3-SiO2GlassSolders

被引:0
作者
周飞
机构
关键词
rare earths; Si; 3N; 4; ceramic; yttria; titanium oxide; oxynitride glass; bonding;
D O I
暂无
中图分类号
TQ174 [陶瓷工业];
学科分类号
0805 ; 080502 ;
摘要
Bonding of Si 3N 4 ceramic was performed with Y 2O 3 Al 2O 3 SiO 2(YAS) X glass solders,which were mixed with TiO 2 (YT) and Si 3N 4 (YN), respectively. The effects of bonding conditions and interfacial reaction on the joint strength were studied. The joint strength in different bonding conditions was measured by four point bending tests. The interfacial microstructures were observed and analyzed by SEM, EPMA and XRD. It is shown that with the increase of bonding temperature and holding time, the joint strength increases reaching a peak, and then decreases. When TiO 2 is put into YAS solder,the bonding interface with Si 3N 4/(Y Sialon glass+TiN)/TiN/Y Sialon glass is formed. When YAS solder is mixed with Si 3N 4 powder, the interfacial residual thermal stress may be decreased, and then the joint strength is enhanced. According to microanalyses, the bonding strength is related to interfacial reaction.
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页码:90 / 96
页数:7
相关论文
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