Microstructure and strength of the TiAl/40Cr joint diffusion-bonded with Ti-V-Cu filler metal

被引:0
作者
冯吉才
何鹏
钱乙余
韩杰才
张秉刚
机构
[1] StateKeyLaboratoryofAdvancedWeldingProductionTechnology
[2] StateKeyLaboratoryofAdvancedWeldingProductionTechnology HarbinInstituteofTechnology
关键词
diffusion bonding; microstructure; TiAl;
D O I
暂无
中图分类号
TG457 [各种金属材料和构件的焊接];
学科分类号
080201 ; 080503 ;
摘要
In this study, intermetallic TiAl and steel 40Cr are diffusion bonded successfully by using a composite barrien layer Ti/V/Cu. In this case, a diphase Ti 3Al+TiAl layer and a Ti solid solution which enhance the strength of the joint are obtained at the TiAl/Ti interface. The interface of TiAl/Ti/V/Cu/40Cr was free from intermetallic compounds and other brittle phases, and the strength of the joint was as high as 420 MPa , very close to that of the TiAl base. This method gives a reliable bonding of intermetallic TiAl and steel 40Cr.
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页码:56 / 58
页数:3
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