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- [3] Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling IEEE ACCESS, 2020, 8 : 14146 - 14154
- [4] Coupled Thermo-Mechanical analysis of 3D ICs Based on an Equivalent Modeling Methodology with Sub-Modeling IEEE Access, 2020, 8 : 14146 - 14154