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- [6] Electromigration Behavior of Cu Core Solder Joints Under High Current Density Electronic Materials Letters, 2020, 16 : 513 - 519
- [8] Electromigration-induced β-Sn grain rotation in lead-free flip chip solder bumps 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 2036 - 2041