Anomalous Resistivity in Vanadium-Doped Semi-Insulating 4H-SiC Wafers

被引:0
作者
Xianglong Yang
Kun Yang
Yingxin Cui
Yan Peng
Xiufang Chen
Xuejian Xie
Xiaobo Hu
机构
[1] StateKeyLaboratoryofCrystalMaterials,ShandongUniversity
关键词
SiC; Anomalous resistivity; Polytype inclusion; Activation energy; Compensation mechanism;
D O I
暂无
中图分类号
TN304.2 [化合物半导体];
学科分类号
0805 ; 080501 ; 080502 ; 080903 ;
摘要
The resistivities of vanadium-doped semi-insulating 4H-SiC wafers were measured by a contactless resistivity measurement system. Anomalous resistivity was found in semi-insulating 4H-SiC wafer. Raman spectra of semi-insulating4H-SiC wafer indicated that the anomalous resistivity was caused by polytype inclusion. Based on the activation energies of different SiC polytypes calculated from resistivity versus temperature data measured by COREMA-VT, the resistivities in the vanadium-doped semi-insulating 4H-SiC wafer with 6H polytype inclusion were calculated. The calculated resistivities are quite consistent with the measured resistivities. Furthermore, the compensation mechanism for the formation of anomalous resistivity was proposed.
引用
收藏
页码:1083 / 1087
页数:5
相关论文
共 50 条
[31]   Electron Mobility in Bulk n-Doped SiC-Polytypes 3C-SiC, 4H-SiC, and 6H-SiC: A Comparison [J].
Rodrigues, C. G. .
SEMICONDUCTORS, 2021, 55 (07) :625-632
[32]   Generation of stacking faults in highly doped n-type 4H-SiC substrates [J].
Zhang, M ;
Hobgood, HM ;
Treu, M ;
Pirouz, P .
SILICON CARBIDE AND RELATED MATERIALS 2003, PRTS 1 AND 2, 2004, 457-460 :759-762
[33]   Abnormal out-diffusion of epitaxially doped boron in 4H-SiC caused by implantation and annealing [J].
Negoro, Yuki ;
Kimoto, Tsunenobu ;
Matsunami, Hiroyuki ;
Pensl, Gerhard .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (8A) :5053-5056
[34]   Characterization of surface defects of highly N-doped 4H-SiC substrates that produce dislocations in the epitaxial layer [J].
Ishikawata, Yukari ;
Sugawara, Y. ;
Saitoh, H. ;
Danno, K. ;
Kawai, Y. ;
Shibata, N. ;
Hirayama, T. ;
Ikuhara, Y. .
SILICON CARBIDE AND RELATED MATERIALS 2009, PTS 1 AND 2, 2010, 645-648 :351-+
[35]   Stacking Fault Formation in Highly Nitrogen-doped 4H-SiC Substrates with Different Surface Preparation Conditions [J].
Katsuno, M. ;
Nakabayashi, M. ;
Fujimoto, T. ;
Ohtani, N. ;
Yashiro, H. ;
Tsuge, H. ;
Aigo, T. ;
Hoshino, T. ;
Tatsumi, K. .
SILICON CARBIDE AND RELATED MATERIALS 2007, PTS 1 AND 2, 2009, 600-603 :341-344
[36]   Structural and electrical properties of unintentionally doped 4H-SiC epitaxial layers—Grown by hot-wall CVD [J].
G. Wagner ;
B. Thomas ;
J. Doerschel ;
J. Dolle ;
K. Irmscher .
Journal of Electronic Materials, 2001, 30 :207-211
[37]   Structural and electrical properties of unintentionally doped 4H-SiC epitaxial layers - Grown by hot-wall CVD [J].
Wagner, G ;
Thomas, B ;
Doerschel, J ;
Dolle, J ;
Irmscher, K .
JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (03) :207-211
[38]   Temperature-dependent photoluminescence spectra mechanism analysis of N-B co-doped 4H-SiC [J].
Zhong, Guanglei ;
Ci, Shuang ;
Peng, Yan ;
Hu, Guojie ;
Zhang, Fusheng ;
Xie, Xuejian ;
Yang, Xianglong ;
Chen, Xiufang ;
Hu, Xiaobo ;
Xu, Xiangang .
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2022, 148
[39]   High-power-density 0.25 μm gate-length AlGaN/GaN high-electron-mobility transistors on semi-insulating 6H-SiC substrates [J].
Lee, JW ;
Kumar, V ;
Adesida, I .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (1A) :13-17
[40]   A Trench and Field Limiting Rings Co-Assisted JTE Termination With N-P-N Sandwich Epitaxial Wafers for 4H-SiC Devices [J].
Yuan, Jun ;
Cheng, Zhijie ;
Guo, Fei ;
Wang, Kuan ;
Chen, Wei ;
Wu, Yangyang ;
Xu, Shaodong ;
Xin, Guoqing ;
Wang, Zhiqiang .
IEEE ELECTRON DEVICE LETTERS, 2024, 45 (08) :1425-1428