Curing mechanism of TDE-85/MeTHPA epoxy resin modified by polyurethane

被引：0
|
作者：
李芝华 [1 ]
郑子樵 [1 ]
任冬燕 [2 ]
黄耀鹏 [1 ]
机构：
[1] School of Materials Science and Engineering,Central South University
[2] Department of Materials Engineering,Mianyang Vocational and Technical College
来源：
Journal of Central South University of Technology | 2007年 / 03期
关键词：
polyurethane; epoxy resin; modification; curing mechanism;
D O I：
暂无
中图分类号：
TQ323.5 [环氧树脂及塑料];
学科分类号：
摘要：
Diglycidyl 4,5-epoxy tetrahydro phthalatemethyl tetrahydrophthalic anhydride (TDE-85MeTHPA) epoxy resin modified by polyurethane (PU) was prepared with 1,4-butanediol (1,4-BDO), trimethylol propane (TMP) and polyurethane prepolymer synthesized by polypropylene glycol and toluene diisocynate. Chemical reaction and curing mechanism of this system were discussed by incorporating the results of infra spectrum analysis. The results indicate that the epoxy polymeric networkⅠis obtained by the curing reaction between TDE-85 and MeTHPA, while the PU polymeric network Ⅱ is obtained by the chain-extended and crosslinking reaction between 1,4-BDO, TMP and polyurethane prepolymer(PUP). The graft chemical bonds are formed between polymer networksⅠ and Ⅱ that therefore increase the degree of blend and compatibility between epoxy polymer and PU.
引用
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页码：296 / 300
页数：5
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