Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

被引：0
作者：
CHEN ChaoGUO HongCHU KeYIN FazhangZHANG XimingHAN Yuanyuanand FAN Yeming The General Research Institute of Nonferrous Metals BeijingBeijing China [100088 ]
机构：
来源：
RareMetals | 2011年 / 30卷 / 04期
关键词：
metallic matrix composites; thermal conductivity; diamonds; copper; size distribution; pressure infiltration;
D O I：
暂无
中图分类号：
TB332 [非金属复合材料];
学科分类号：
0805 ; 080502 ;
摘要：
The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied.The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 μm-size diamonds.The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated.The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu.It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.
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页码：408 / 413
页数：6
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