Ductility of metal thin films in flexible electronics

被引:0
作者
NIU RongMei LIU Gang DING XiangDong SUN Jun State Key Laboratory for Mechanical Behavior of Materials and School of Materials Science Engineering Xian Jiaotong University Xian China [710049 ]
机构
关键词
thin films; deformation; flexible electronics;
D O I
暂无
中图分类号
TB383.2 [];
学科分类号
070205 ; 080501 ; 1406 ;
摘要
Flexible, large area electronics using various organic and inorganic materials are beginning to show great promise. During manufacture and service, large deforma- tion of these hybrid materials will pose significant challenges in terms of high performance and reliability. A deep understanding of the ductility or flexibility of macroelectronics becomes one of the major issues that must be addressed ur- gently. This paper describes the current level of understanding on the thin-film ductility, both free-standing and substrate-supported, and relevant influencing factors.
引用
收藏
页码:1971 / 1979
页数:9
相关论文
共 14 条
[1]   Material challenge for flexible organic devices [J].
Lewis, Jay .
MATERIALS TODAY, 2006, 9 (04) :38-45
[2]  
Constraint Effects on Thin Film Channel Cracking Behavior[J] . Ting Y. Tsui,Andrew J. McKerrow,Joost J. Vlassak.Journal of Materials Research . 2005 (9)
[3]  
Size dependence of mechanical properties of gold at the sub-micron scale[J] . J.R. Greer,W.D. Nix.Applied Physics A . 2005 (8)
[4]   On the interface debond at the edge of a thin film on a thick substrate [J].
Alaca, BE ;
Saif, MTA ;
Sehitoglu, H .
ACTA MATERIALIA, 2002, 50 (05) :1197-1209
[5]   Mechanical properties in small dimensions [J].
Vinci, RP ;
Baker, SP .
MRS BULLETIN, 2002, 27 (01) :12-14
[6]   Deformation behavior of thin copper films on deformable substrates [J].
Hommel, M ;
Kraft, O .
ACTA MATERIALIA, 2001, 49 (19) :3935-3947
[7]  
Plastic deformation and strength of materials in small dimensions[J] . Shefford P Baker.Materials Science & Engineering A . 2001
[8]   A reformulation of strain gradient plasticity [J].
Fleck, NA ;
Hutchinson, JW .
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2001, 49 (10) :2245-2271
[9]  
Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation[J] . R-M. Keller,S. P. Baker,E. Arzt.Journal of Materials Research . 1998 (5)
[10]  
Tensile and fracture behavior of free-standing copper films[J] . R.R Keller,J.M Phelps,D.T Read.Materials Science & Engineering A . 1996 (1)