共 4 条
- [1] Mohr J,Ehrfeld W,Munchmeyer D.Requirements on resist layers in deep-etch synchrotron radiation lithography. J. Vac. Technol . 1988
- [2] Pantengurg F J,Chlebek J,El-Kholi A,et al.Adhesion problems in deep-etch X-ray lithography caused by fluorescence radiation from the plating base. Microelectronics Journal . 1994
- [3] Tang Esheng,Yan Yonglian,Xia Shaojian,et al.New wiggler beamline at BSRF. Journal of Synchrotron Radiation . 1998
- [4] Becker E W,Ehrfled W,et al.Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process). Microelectronics Journal . 1986