Fabrication of GaN-based LEDs with 22° undercut sidewalls by inductively coupled plasma reactive ion etching

被引:0
作者
王波 [1 ,2 ]
宿世臣 [1 ]
何苗 [1 ]
陈弘 [2 ]
吴汶波 [1 ]
张伟伟 [1 ]
王巧 [1 ]
陈虞龙 [1 ]
高优 [1 ]
张力 [1 ]
朱克宝 [1 ]
雷严 [1 ]
机构
[1] Laboratory of Nanophotonic Functional Materials and Devices,Institute of Optoelectronic Materials and Technology,South China Normal University
[2] Key Laboratory for Renewable Energy,Chinese Academy of Sciences,Beijing Key Laboratory for New Energy Materials and Devices,Beijing National Laboratory for Condense Matter Physics,Institute of Physics,Chinese Academy of Sciences
基金
国家高技术研究发展计划(863计划); 中国国家自然科学基金;
关键词
GaN; light-emitting diode(LED); undercut;
D O I
暂无
中图分类号
TN312.8 []; TN305.7 [光刻、掩膜];
学科分类号
0803 ; 1401 ;
摘要
We use a simple and controllable method to fabricate GaN-based light-emitting diodes(LEDs) with 22?undercut sidewalls by the successful implementation of the inductively coupled plasma reactive ion etching(ICP-RIE).Our experiment results show that the output powers of the LEDs with 22?undercut sidewalls are 34.8 mW under a 20-mA current injection,6.75% higher than 32.6 mW,the output powers of the conventional LEDs under the same current injection.
引用
收藏
页码:449 / 452
页数:4
相关论文
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