Recent advances on thermal analysis of stretchable electronics

被引：1

作者：

Yuhang Li ^{[1
]}

Yuyan Gao ^{[2
]}

Jizhou Song ^{[2
,3
]}

机构：

[1] Institute of Solid Mechanics, Beihang University (BUAA)

[2] Department of Engineering Mechanics, Zhejiang University

[3] Soft Matter Research Center, Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province,Zhejiang University

来源：

Theoretical & Applied Mechanics Letters | 2016年 / 6 卷 / 01期

关键词：

Stretchable electronics; Thermal analysis; Scaling law;

D O I：

暂无

中图分类号：

O572.322 [];

学科分类号：

070202 ;

摘要：

Stretchable electronics, which offers the performance of conventional wafer-based devices and mechanical properties of a rubber band, enables many novel applications that are not possible through conventional electronics due to its brittle nature. One effective strategy to realize stretchable electronics is to design the inorganic semiconductor material in a stretchable format on a compliant elastomeric substrate.Engineering thermal management is essential for the development of stretchable electronics to avoid adverse thermal effects on its performance as well as in applications involving human body and biological tissues where even 1–2 °C temperature increase is not allowed. This article reviews the recent advances in thermal management of stretchable inorganic electronics with focuses on the thermal models and their comparisons to experiments and finite element simulations.

引用

页码：32 / 37

页数：6

共 21 条

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[2]

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