Diffusion bonding of γ-TiAl alloy to Ti-6Al-4V alloy under hot pressure

被引：0

作者：

王秀锋

马蓦

刘学斌

吴学庆

檀朝桂

石荣凯

林建国

机构：

[1] China

[2] Faculty of Material & Photoelectronic Physics Xiangtan University

[3] Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education

[4] Xiangtan 411105

来源：

Transactions of Nonferrous Metals Society of China | 2006年 / 05期

基金：

中国国家自然科学基金;

关键词：

γ-TiAl alloys; Ti-6Al-4V alloys; diffusion bonding; microstructure;

D O I：

暂无

中图分类号：

TG457 [各种金属材料和构件的焊接];

学科分类号：

080201 ; 080503 ;

摘要：

The diffusion bonding of γ-TiAl alloy to Ti-6Al-4V alloy at different temperatures ranging from 1 073 to 1 173 K under an applied stress of 100 MPa for 2 h was studied. The observation of the microstructure reveals that sound joints between the γ-TiAl alloy and the Ti-alloy without any pores or cracks can be achieved through diffusion bonding at temperatures over 1 073 K under the applied stress of 100 MPa for 2 h. The bond is composed of two zones, and its width increases with the increase of bonding temperature. The EDS chemical composition profiles indicate that there is a diffusion flux of Al atoms from γ-TiAl alloy towards the Ti alloy and of Ti atoms in the opposite direction. The three point-bending of the joints bonded under different conditions was tested and the fracture mode was analyzed by SEM observation.

引用

页码：1059 / 1063

页数：5