Effect of cooling and aging on microstructure and mechanical properties of Sn-9Zn solder

被引：3
作者：
王凤江
黄瑛
田爽
张超
机构：
[1] ProvincialKeyLabofAdvancedWeldingTechnology,JiangsuUniversityofScienceandTechnology
来源：
China Welding | 2017年 / 26卷 / 01期
关键词：
Sn-9Zn; cooling rate; aging; microstructure; fracture mode;
D O I：
暂无
中图分类号：
TG42 [焊接材料];
学科分类号：
080201 ; 080503 ;
摘要：
The microstructure and tensile properties of Sn-9Zn solder under different cooling and aging condition were studied. During solidification,the distribution of Zn-rich phases and grain size in the microstructure of Sn-9Zn solder were decided by the cooling rate. The Zn-rich phase in Sn-9Zn solder under furnace cooling,air cooling and water cooling media was separately existed as coarsen dendritic and needle like shape,fine needle like shape and very fine rod-like shape,respectively. After aging,the coarsen dendritic was broken and the coarsen needle like Zn-rich phase was partly changed into fine distribution of Zn-rich phase for Sn-9Zn solder with furnace cooling,and the rod-like Zn phase in the Sn-9Zn solder under water cooling was changed to conglomerated Zn with needle shape. During tensile testing on Sn-9Zn solder,tensile strength and ductility reached the best with water cooling,but decreased with aging effect. Meanwhile,the ductility of solder with air cooling and the strength of solder with furnace cooling increased with aging. The fracture mode was ductile and was independent of cooling media and aging effect. The size and depth of dimples decreased from water,furnace to air cooling.After aging,number and size of dimples increased on the solder with furnace cooling and air cooling. The change on the size of dimples for the Sn-9Zn solder under different cooling condition and with aging effect was accordance to the tensile properties.
引用
收藏
页码：37 / 43
页数：7
相关论文
共 13 条
[1]   Sn-Zn系无铅钎料最新进展 [J].
孙磊 ;
张亮 .
电子工艺技术, 2015, 36 (01) :4-11
[2]  
Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn－9Zn－xNi/Cu Joints[J]. M.L. Huang , N. Kang, Q. Zhou and Y.Z. Huang Key Laboratory of Liaoning Advanced Welding and Joining Technology, School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024, China.Journal of Materials Science & Technology. 2012(09)
[3]  
Ti addition to enhance corrosion resistance of Sn–Zn solder alloy by tailoring microstructure[J] . Jian-Chun Liu,Gong Zhang,Ju-Sheng Ma,Katsuaki Suganuma.Journal of Alloys and Compounds . 2015
[4]  
Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn–9Zn alloy[J] . Yanxia Jing,Guangmin Sheng,Guoji Zhao.Materials and Design . 2013
[5]  
Effect of bismuth and silver on the corrosion behavior of Sn–9Zn alloy in NaCl 3wt.% solution[J] . A. Ahmido,A. Sabbar,H. Zouihri,K. Dakhsi,F. Guedira,M. Serghini-Idrissi,S. El Hajjaji.Materials Science & Engineering B . 2011 (13)
[6]  
Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature[J] . K.N. Prabhu,Parashuram Deshapande,Satyanarayan.Materials Science & Engineering A . 2011
[7]  
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products[J] . Dhafer Abdulameer Shnawah,Mohd Faizul Mohd Sabri,Irfan Anjum Badruddin.Microelectronics Reliability . 2011 (1)
[8]  
Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders[J] . A.A. El-Daly,A.E. Hammad.Materials Science & Engineering A . 2010 (20)
[9]  
Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure array[J] . Leonardo R. Garcia,Wislei R. Osório,Leandro C. Peixoto,Amauri Garcia.Materials Characterization . 2009 (2)
[10]  
Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages[J] . Asit Kumar Gain,Y.C. Chan,Ahmed Sharif,N.B. Wong,Winco K.C. Yung.Microelectronics Reliability . 2009 (7)
12