Enhanced mechanical properties in Al/diamond composites by Si addition

被引:0
作者
Jian-Hua Wu [1 ]
Hai-Long Zhang [2 ]
Yang Zhang [2 ]
Jian-Wei Li [2 ]
Xi-Tao Wang [2 ]
机构
[1] Shandong Engineering Research Center for Lightweight Automobiles Magnesium Alloy,New Materials,Shandong Academy of Sciences
[2] State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing
基金
中国国家自然科学基金; 中央高校基本科研业务费专项资金资助;
关键词
Composite materials; Diamond particles; Mechanical properties; Interfaces;
D O I
暂无
中图分类号
TB33 [复合材料];
学科分类号
0805 ; 080502 ;
摘要
Diamond particles reinforced aluminum–silicon matrix composites,abbreviated as Al(Si)/diamond composites,were fabricated by squeeze casting.The effect of Si content on the microstructure and mechanical properties of the composites were investigated.The mechanical properties are found to increase monotonically with Si content increasing up to 7.0 wt%.The Al-7.0 wt% Si/diamond composite exhibits tensile strength of 78 MPa,bending strength of 230 MPa,and compressive strength of426 MPa.Al–Si eutectic phases are shown to connect with Al matrix and diamond particles tightly,which is responsible for the enhancement of mechanical properties in the Al(Si)/diamond composites.
引用
收藏
页码:701 / 704
页数:4
相关论文
共 15 条
  • [11] Effect of diamond crystallographic orientation on dissolution and carbide formation in contact with liquid aluminium
    Kleiner, S.
    Khalid, F. A.
    Ruch, P. W.
    Meier, S.
    Beffort, O.
    [J]. SCRIPTA MATERIALIA, 2006, 55 (04) : 291 - 294
  • [12] The Influence of Silicon Content on the Thermal Conductivity of Al-Si/Diamond Composites. Zhang Y,Wang X T,Wu J H. International Conference on Electronic Packaging Technology and High Density Packaging . 2009
  • [13] Interface formation in infiltrated Al(Si)/diamond composites[J] . O. Beffort,F.A. Khalid,L. Weber,P. Ruch,U.E. Klotz,S. Meier,S. Kleiner.Diamond & Related Materials . 2005 (9)
  • [14] On the thermal and chemical stability of diamond during processing of Al/diamond composites by liquid metal infiltration (squeeze casting)
    Beffort, O
    Vaucher, S
    Khalid, FA
    [J]. DIAMOND AND RELATED MATERIALS, 2004, 13 (10) : 1834 - 1843
  • [15] Thermal properties of diamond/copper composite material[J] . Katsuhito Yoshida,Hideaki Morigami.Microelectronics Reliability . 2003 (2)