Study on the mechanical behavior of adhesive interface by digital image correlation

被引：0
作者：
GUO BaoQiao XIE HuiMin ZHU JianGuo WANG HuaiXi CHEN PengWan ZHANG QingMing Key Laboratory of Applied MechanicsDepartment of Engineering MechanicsTsinghua UniversityBeijing China State Key Laboratory of Explosion Science and TechnologyBeijing Institute of TechnologyBeijing China [1 ,2 ,1 ,1 ,1 ,2 ,2 ,1 ,100084 ,2 ,100081 ]
机构：
来源：
Science China(Physics,Mechanics & Astronomy) | 2011年 / 04期
关键词：
single lap joint; shear modulus; adhesive interface; failure; digital image correlation;
D O I：
暂无
中图分类号：
TG491 [粘接理论];
学科分类号：
080201 ; 080503 ;
摘要：
The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper.The aluminum-aluminum adherends are bonded by two different adhesives:polydimethylsiloxane (PDMS) and epoxy.The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope.Then,the shear modulus values of the two adhesives are calculated with a simple pure shear strain model.A numerical model is proposed to simulate the single lap joint structure under tensile load in comparison with the experimental results.The results show that this method can successfully estimate the shear modulus of the adhesive layer.The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.
引用
收藏
页码：574 / 580
页数：7
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