Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger

被引：1

作者：

Diancheng Qin ^{[1
]}

Kewei Liang ^{[2
]}

机构：

[1] Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center

[2] Rayben Technologies (Zhuhai) Limited

来源：

Journal of Harbin Institute of Technology(New Series) | 2020年 / 27卷 / 01期

关键词：

MHE; MCPCB; heat dissipation performance; LED; optical property;

D O I：

暂无

中图分类号：

TN41 [印刷电路];

学科分类号：

080903 ; 1401 ;

摘要：

A Metal Core Printed Circuit Board with Micro Heat Exchanger(MHE MCPCB) was introduced for thermal management of high power LED. A comparative study was performed between 4 W/(m·K) regular MCPCB and this novel MCPCB to investigate the heat dissipation performance of this novel MCPCB. It was found that MHE MCPCB can obviously enhance the comprehensive optical properties of LED in comparison with 4 W/(m·K) regular MCPCB. Additionally, thermal contact resistance confining a dominant part of heat within the micro heat exchanger to achieve high efficient heat dissipation was proved.

引用

页码：91 / 96

页数：6

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