Recessed-gate quasi-enhancement-mode AlGaN/GaN high electron mobility transistors with oxygen plasma treatment

被引:0
作者
何云龙 [1 ]
王冲 [1 ]
宓珉瀚 [1 ]
郑雪峰 [1 ]
张濛 [2 ]
赵梦荻 [1 ]
张恒爽 [1 ]
陈立香 [2 ]
张进成 [1 ]
马晓华 [1 ,2 ]
郝跃 [1 ,2 ]
机构
[1] Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University
[2] School of Advanced Materials and Nanotechnology, Xidian University
基金
中国国家自然科学基金;
关键词
AlGaN/GaN; high electron mobility transistors; recessed-gate; oxygen plasma;
D O I
暂无
中图分类号
TN386 [场效应器件];
学科分类号
0805 ; 080501 ; 080502 ; 080903 ;
摘要
In this paper,the enhancement-mode AlGaN/GaN HEMT combined with the low damage recessed-gate etching and the optimized oxygen plasma treatment was fabricated.Scanning electron microscope/energy dispersive spectrometer(SEM/EDS) method and x-ray photoelectron spectroscopy(XPS) method were used to confirm the formation of oxides.Based on the experimental results,the obtained enhancement-mode HEMT exhibited a threshold voltage of 0.5 V,a high peak transconductance of 210 mS/mm,and a maximum drain current of 610 mA/mm at the gate bias of 4 V.Meanwhile,the on/off current ratio of enhancement-mode HEMT was as high as 10;,drain induced barrier lowering(DIBL) was as low as 5 raV/V,and subthreshold swing(SS) of 80 mV/decade was obtained.Compared with the conventional HEMT,the Schottky reverse current of enhancement-mode HEMT was three orders of magnitude lower,and the off-state breakdown voltage of which was higher.In addition,a power gain cutoff frequency(/max) of the enhancement-mode HEMT was larger than that of the conventional one.
引用
收藏
页码:474 / 479
页数:6
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