Pressure infiltrated Cu/diamond composites for LED applications

Diamond reinforced copper (Cu/diamond) composites were prepared by a pressure infiltration technique.The composites show a super high conductivity of 713 W m-1 K-1 in combination with an extremely low coefficient of thermal expansion (CTE) of 7.72 × 10-6 K-1 (25-100 ℃),which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles.By adopting a series of postmachining techniques the composites were made into near-net-shape parts,and an electroless silver coating was also successfully plated on the composites.Finally,their potential applications in the thermal management of light emitting diodes (LED) were illustrated via prototype examples.