A comparison of processes and challenges between organic, a-Si:H, and oxide TFTs for active matrix backplanes on plastic

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作者
De La Fuente Vornbrock, Alejandro [1 ]
Almanza-Workman, Marcia [2 ]
Dickin, Fraser [3 ]
Elder, Richard E. [1 ]
Garcia, Robert A. [2 ]
Holland, Edward [1 ]
Jackson, Warren [1 ]
Jam, Mehrban [1 ]
Jeans, Albert [1 ]
Kim, Han-Jun [2 ]
Kwon, Ohseung [2 ]
Luo, Hao [1 ]
Maltabes, John [1 ]
Mei, Ping [1 ]
Perlov, Craig [1 ]
Rudin, John C. [3 ]
Smith, Mark [1 ]
Trovinger, Steven [1 ]
Zhao, Lihua [1 ]
Taussig, Carl P. [1 ]
机构
[1] Hewlett Packard Laboratories, 1501 Page Mill Rd, MS 1198, Palo Alto, CA, 94303-1100, United States
[2] Phicot, Inc., 1501 Page Mill Rd, MS 1198, Palo Alto, CA, 94303-1100, United States
[3] Hewlett Packard Laboratories, Long Down Avenue, Stoke Gifford, Bristol, BS34 8QZ, United Kingdom
来源
HP Laboratories Technical Report | 2012年 / 66期
关键词
Amorphous films - Flexible displays - Thin film transistors - II-VI semiconductors - Substrates - Tin oxides - Silicon compounds - Zinc oxide - Flat panel displays;
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摘要
Processes to produce active-matrix backplanes on plastic substrates have been developed utilizing a-Si:H, multi-component oxide, and organic semiconductor technologies. The suitability of these technologies for future flat panel display applications is discussed. Of these material systems multi-component oxides exhibit highest field-effect mobilities (10cm 2/Vs for zinc tin oxide demonstrated), followed by small molecule organic semiconductors (0.95 cm2/Vs), and a-Si:H (0.5 cm 2/Vs). Yet despite higher mobilities, organic TFTs drive less current than a-Si:H because of the low device capacitances required to fabricate such devices. Backplanes made with a-Si:H appear to be the least risky technology, followed by multi-component oxide, and organic semiconductor technologies. © Copyright 2012 Hewlett-Packard Development Company, L.P.
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