Silicon wafer integrated fan-out technology packaging

被引：0

作者：

Zwenger, Curtis ^{[1
]}

Scott, George ^{[1
]}

Baloglu, Bora ^{[1
]}

Jayaraman, Suresh ^{[1
]}

Do, WonChul ^{[2
]}

Lee, WonGeol ^{[2
]}

Yi, JiHun ^{[2
]}

机构：

[1] Amkor Technology, Inc., 2045 E. Innovation Circle, Tempe,AZ,85284, United States

[2] Amkor Technology, Korea, 150, Songdomirae-ro, Yeonsu-gu, Incheon,21991, Korea, Republic of

来源：

Advancing Microelectronics | 2018年 / 45卷 / 01期

关键词：

Chip scale packages;

D O I：

暂无

中图分类号：

TN3 [半导体技术]; TN4 [微电子学、集成电路（IC）];

学科分类号：

0805 ; 080501 ; 080502 ; 080903 ; 1401 ;

摘要：

This paper reviews Silicon Wafer Integrated Fan-out Technol-ogy (SWIFT®) packaging methodology and its performance in a typical mobile application. In addition, the advantages of a SWIFT design are reviewed in comparison to a conventional competing 3D packaging technology. Package information, electrical simulation, and reliability test data will be presented to show how SWIFT technology is poised to provide robust, reliable, and low-cost 3D packaging solutions for advanced mobile products. © 2010 - 2017, Amkor Technology, Inc. All rights reserved.

引用

页码：6 / 9