Fabrication of Diamond/Copper Composites by Hot Isostatic Pressing

被引：0

作者：

Wang, Fangyu ^{[1
,2
]}

Wang, Wenchao ^{[1
,2
]}

Shi, Ming ^{[2
]}

Lin, Yue ^{[2
]}

Guo, Wang ^{[1
,2
]}

Yuan, Xuanyi ^{[1
]}

Cao, Yongge ^{[1
]}

机构：

[1] Beijing Key Laboratory of Opto-electronic Functional Materials & Micro-nano Devices, Renmin University of China, Beijing,100872, China

[2] Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences, Fuzhou,350002, China

来源：

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering | 2017年 / 46卷 / 03期

关键词：

Spark plasma sintering - Copper - Metallic matrix composites - Thermal conductivity - Hot isostatic pressing - Thermal expansion - Fabrication;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Diamond/copper composites were fabricated by hot isostatic pressing (HIP) at 900℃ and under 110 MPa for 1 h, and their microstructure and thermal properties were also studied. The results show that diamond particles are dispersed homogeneously in the copper matrix without evident graphitization. With increasing the volume fraction of diamond, the relative density, thermal conductivity and coefficient of thermal expansion of the composites decrease. The maximum relative density and thermal conductivity of these samples are up to 98.5% and 305 W·(m·K)-1, respectively. The diamond/copper composites prepared by HIP can achieve a thermal conductivity equal to or even higher than those fabricated by hot pressing (HP) and spark plasma sintering (SPS). Obviously, HIP shows great potential in preparing diamond/copper composites. © 2017, Science Press. All right reserved.

引用

页码：853 / 856