Smile Effect Measurement of Laser Diode Line Arrays Based on External Cavity

被引:0
作者
Li, Jing [1 ]
Cao, Yin-Hua [1 ]
Liu, You-Qiang [1 ]
Xu, Shang-Rui [1 ]
Qin, Wen-Bin [1 ]
Qiu, Yun-Tao [1 ]
Yao, Lei [1 ]
Zeng, Xiao-Di [1 ]
Wang, Zhi-Yong [1 ]
机构
[1] Institute of Laser Engineering, Beijing University of Technology, Beijing,100124, China
来源
Faguang Xuebao/Chinese Journal of Luminescence | 2017年 / 38卷 / 10期
关键词
Laser mirrors - Light emission - Semiconductor diodes - Chip scale packages - Laser excitation;
D O I
10.3788/fgxb20173810.1302
中图分类号
学科分类号
摘要
The smile effect was measured in the process of semiconductor laser packaging using the external cavity mirror of which the reflectance was greater than the front cavity surface of the semiconductor to form external cavity semiconductor laser. In measurement, the cylindrical lens was inserted in the external cavity. The external laser cavity was only formed between the outer mirror and the single light emitting point in the cylindrical lens light axis. The laser threshold of the light emitting point was reduced to output laser under the excitation current less than the normal threshold value. The light emitting point of the diode laser was selected one by one by moving the cylinder lens, so the smile effect was measured by summarizing all beam position. The low current is no harmful effects on the diode laser bar, and the influence of the other emitters on CCD is avoided by measuring single emitter. © 2017, Science Press. All right reserved.
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页码:1302 / 1306
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