Numerical Study on Thermal Characteristics of a Micro-Encapsulated Phase Change Composite Plate

被引：0

作者：

Fu, Yun-Di ^{[1
]}

Qu, Zhi-Guo ^{[1
]}

Zhang, Jia-Jie ^{[1
]}

机构：

[1] MOE Key Lab of Thermo-Fluid Science and Engineering, Xi'an Jiaotong University, Xi'an,710049, China

来源：

Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics | 2018年 / 39卷 / 05期

关键词：

Phase interfaces - Heat transfer - Thermal insulation - Phase change materials;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

A coupling numerical model, basing on the enthalpy formulation, is established to study the heat transfer performances of micro-encapsulated phase change composite plate. The temperature profiles and the movement features of solid-liquid phase interface are obtained. The effects of different Stefan numbers, variable phase change temperature scopes are investigated, and none-phase change material condition is calculated. The results show that micro-encapsulated phase change material (MEPCM) plays a great role in thermal insulation. The movement speed of solid phase interface is higher than that of liquid phase interface and the movement speed of liquid phase interface increases obviously when all of the solid phase melted. Furthermore, with the increase of Stefan Number, the movement speeds of the two interfaces and the plate temperature increase. Additionally, the movement speed of solid phase interface and the acceleration of liquid phase interface in the end of phase change process rise with the phase change temperature scope increase. However, the phase change temperature scope has a limited impact on the completely melting time. © 2018, Science Press. All right reserved.

引用

页码：1078 / 1084