NUMERICAL ANALYSIS OF IMMERSED CONFINED COAXIAL LIQUID JET IMPINGEMENT HEAT TRANSFER FOR ELECTRONICS THERMAL MANAGEMENT

A large amount of data has been loaded into data centers as well as faster computational time due to the current emergence of artificial intelligence (AI), augmented reality (AR), 5G mobile networks, and digital currencies. These data require a significant amount of processing power, and as a result, this enormous processing performance generates heat in electronic chips and data center racks specifically. Conventional cooling methods are not capable of answering thermal management requirements in electronic systems. Therefore, novel techniques are needed to meet aggressive demands. One of those candidate cooling approaches is dielectric liquid impingement heat transfer. A computational study has been performed to understand the impact on chip cooling. The current study uses a constant heat flux thermal boundary condition to computationally analyze a confined coaxial impingement water jet on a heated flat plate. Four velocity ratios, three jet to target distances, and three different Re numbers have been studied through numerical simulations. The finite volume method (FVM) was used to solve the governing equations on discretized elements with RANS SST k-omega turbulence model. It has been noted that the local heat transfer coefficients increase with increasing Re numbers. On the heated flat plate, increasing the jet to target distance and decreasing the velocity ratio cause turbulence effects and increase in Nu number over the radial distance especially in the stagnation region. Additionally, it was revealed that the coaxial jet's attained higher heat transfer characteristics than the single circular jet's.