Meta-Dispersive 3D Chromatic Confocal Measurement

被引:0
作者
Wu, Jiajun [1 ,2 ]
Yao, Jin [2 ]
Ren, An [1 ]
Ju, Zhizheng [1 ]
Lin, Rong [2 ]
Wang, Zhihui [2 ]
Zhu, Wule [1 ]
Ju, Bingfeng [1 ]
Tsai, Din Ping [2 ,3 ,4 ,5 ]
机构
[1] Zhejiang Univ, Sch Mech Engn, State Key Lab Fluid Power & Mechatron Syst, Hangzhou 310027, Peoples R China
[2] City Univ Hong Kong, Dept Elect Engn, Hong Kong 999077, Peoples R China
[3] City Univ Hong Kong, Dept Phys, Hong Kong 999077, Peoples R China
[4] City Univ Hong Kong, State Key Lab Terahertz & Millimeter Waves, Hong Kong 999077, Peoples R China
[5] City Univ Hong Kong, Ctr Biosyst Neurosci & Nanotechnol, Hong Kong 999077, Peoples R China
基金
中国国家自然科学基金;
关键词
3D measurement; chromatic confocal; dispersion engineering; dispersive metalens; metasurfaces; BAND ACHROMATIC METALENS; METASURFACE; LIGHT; LENS;
D O I
10.1002/advs.202508774
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
3D reconstruction can perceive the detailed structures of real-world objects. Integrating metasurfaces with stereo vision or structured-light projection enables compact and efficient 3D reconstruction systems, beneficial for next-generation sensing, augmented reality, and biomedical applications. Nevertheless, the limitations inherent in these visual measurement methods pose a significant challenge to achieving higher resolution. Here, a dispersive metalens (DML) combined with the chromatic confocal method is proposed to achieve high-precision 3D measurement. With appropriate engineered dispersion, the linearity of the dispersion is well maintained, alongside diffraction-limited focusing performance. As a proof-of-concept, experiments on both longitudinal and transversal measurements are conducted. Following the calibration of the DML, axial accuracy of +/- 4 mu m and a subwavelength axial resolution of 0.325 mu m is achieved. The successful reconstruction of a fabricated 3D USAF-1951 resolution test chart further corroborates the 3D measurement capability, demonstrating a lateral resolution exceeding 4.38 mu m. It is envisioned that the proposed method will pave the way for future applications in areas such as microstructure characterization, industrial inspection, and on-chip 3D optical metrology.
引用
收藏
页数:9
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