Epoxy nanocomposite with 3D network of SiC NWs@BNNs/carbon foam derived from steamed bun with enhanced thermal conductivity and electromagnetic wave absorption properties

With the high integration and rapid innovation of electronic components, the heat dissipation and electromagnetic radiation hazards of microelectronic devices are facing severe challenges. In this work, a three-dimensional (3D) mSiC NWs@mBNNs/carbon foam network structure is based on the steamed bun strategy. For performances, one-dimensional modified silicon carbide nanowires (mSiC NWs) linked with two-dimensional modified boron nitride nanosheets (mBNNs) significantly improved the thermal conductivity of epoxy (EP) impregnated composites (mSiC NWs@mBNNs/C/EP), which ensures that the thermal conductivity of mSiC NWs@mBNNs/C/EP reaches 2.03 W/m<middle dot>K at 9.89 wt% filler loading and achieves the thermal conductivity enhancement of 1027 % at mSiC NWs to mBNNs mass ratios of 1:7 compared pure EP. This is attributed to the fact that mSiC NWs@mBNNs/C/EP has higher connectivity and lower interfacial thermal resistance (8.14 x 10(-7) m(2) K/W) than composites with a single filler. Furthermore, mSiC NWs@mBNNs/C/EP displays excellent electromagnetic wave absorption property with a minimum reflection loss of -23.1 dB at 10.3 GHz and effective absorption bandwidth (<-10 dB) of 8.6-12.0 GHz. Therefore, the EP-based electronic packaging composite obtained in this study have considerable application potentials in the fields of heat dissipation and electromagnetic shielding of microelectronic devices.