Effect of P on microstructure and mechanical properties of Sn-Bi solder

被引：0

作者：

Wang X.-J. ^{[1
]}

Liu B. ^{[1
]}

Zhou H.-L. ^{[2
]}

Wang J.-X. ^{[1
]}

Liu N. ^{[1
]}

Li T.-Y. ^{[1
]}

机构：

[1] School of Material Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212003, Jiangsu

[2] Bantian Huawei Base, Huawei Technologies Co., Ltd., Shenzhen, 518129, Guangdong

来源：

Cailiao Gongcheng/Journal of Materials Engineering | 2016年 / 44卷 / 07期

关键词：

Fracture; Microstructure; P; Sn-Bi; Tensile property;

D O I：

10.11868/j.issn.1001-4381.2016.07.019

中图分类号：

学科分类号：

摘要：

Micro alloy metals P or P/Cu/Zn were added into Sn-Bi alloy to investigate the doping effects on microstructure, mechanical property, deformation fracture from the function of P in pure tin. The results show that doping 1%( mass fraction, same as below) P to pure tin can improve the strength and stiffness, decrease the plasticity. Only 0.1%P additive degenerates the mechanical property of Sn-Bi alloy, this is related to the existing form of element P in the base metal and the microstructure of the base metal. In Sn base alloy, P is distributed in phase or grain boundaries in the form of Sn-P intermetallic compounds (IMC), restricting the diffusion and shifting of deformation. Therefore, Sn-1P alloy, IMC distributed in beta-tin base plays a role of strengthening in pure tin doped situation, in Sn-Bi alloy instead, enhancing the deformation mismatch under loading becoming the weak spots where cracks may initiate and propagate, and leading to brittle fracture. Finally, addition of P/Zn/Cu simultaneously to Sn-Bi alloy, the doping can optimize the microstructure, improve the strength and enhance the ultimate tensile strength (UTS) of Sn-Bi alloys. © 2016, Journal of Materials Engineering. All right reserved.

引用

页码：113 / 118

页数：5

共 21 条

[1]

Tong X.C., Thermal Interface Materials in Electronic Packaging, in Advanced Materials for Thermal Management of Electronic Packaging, pp. 305-371, (2011)

[2]

Zhang L., Xue S.B., Gao L.L., Et al., Development of Sn-Zn lead-free solders bearing alloying elements, Journal of Materials Science: Materials in Electronics, 21, 1, pp. 1-15, (2010)

[3]

Liu C.Z., Kang T.Y., Wei W., Et al., Effect of high intensity magnetic field on intermetallic compounds growth in SnBi/Cu microelectronic interconnect, Journal of Alloys and Compounds, 509, 33, pp. 8475-8477, (2011)

[4]

Chen S., Zhang L., Liu J., Et al., A reliability study of nanoparticles reinforced composite lead-free solder, Mater Trans, 51, 10, pp. 1720-1726, (2010)

[5]

Zhu Q.S., Song H.Y., Liu H.Y., Et al., Effect of Zn addition on microstructure of Sn-Bi joint, Proceedings of the 9th ICEPT-HDP, pp. 1043-1046, (2009)

[6]

Dutchak Y.I., Qsipenko V.P., Panasyuk P.V., Thermal conductivity of Sn-Bi alloys in the solid and liquid states, Soviet Physics Journal, 11, 10, pp. 145-147, (1968)

[7]

Zang L., Yuan Z., Zhu Y., Et al., Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K, Colloids and Surfaces A: Physicochemical and Engineering Aspects, 414, 11, pp. 57-65, (2012)

[8]

He P., Lu X.C., Zhang B.B., Et al., Effect of alloy element on microstructure and impact toughness of Sn-57Bi lead-free solders, Journal of Materials Engineering, 10, (2010)

[9]

Wang X.J., Zhu Q.S., Liu B., Et al., Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder, J Mater Sci: Mater Electron, 25, 5, pp. 2297-2304, (2014)

[10]

Xian A.P., Gong G.L., Surface oxidation of molten Sn-0.07 wt.% P in air at 280℃, Journal of Materials Research, 23, 6, pp. 1532-1536, (2008)

← 1 2 3 →