Using Layer-by-Layer Self-Assembly in the fabrication of thin films

被引:0
作者
Sangabattula, Lokesh [1 ]
机构
[1] Indian Inst Technol, Dept Met Engn & Mat Sci, Mumbai, Maharashtra, India
来源
2021 IEEE 12TH INTERNATIONAL CONFERENCE ON MECHANICAL AND INTELLIGENT MANUFACTURING TECHNOLOGIES, ICMIMT | 2021年
关键词
Layer-by-Layer self-assembly; poly (diallyl dimethylammonium chloride) (PDDA); copper phthalocyanine-tetrasulfonic acid (CuTsPc); Atomic Force Microscopy; UV-Vis spectroscopy; Nanoscience; Nanotechnology;
D O I
10.1109/ICMIMT52186.2021.9476205
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
The latest innovation in the field of nanoscience demonstrate integration of nano architectonics with the Layer-by-Layer (LBL) technique. The LBL technique is leveraged in this study to perform thin film fabrication using poly (diallyl dimethylammonium chloride) (PDDA) and copper phthalocyanine-tetrasulfonic acid (CuTsPc). The deposition of PPDA/CuTsPc films over a glass substrate through alternate adsorption is studied in this research. Both manual and automated methods are examined to evaluate the efficiency of the LBL technique. This is affirmed by an orderly deposition process that is observed as a result of Atomic Force Microscopy and UV-Vis spectroscopy. The results also indicate that this method is viable in terms of affordability and reproducibility even without exercising control over parameters such as pH and temperature.
引用
收藏
页码:165 / 168
页数:4
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