Robust Transition Metal Contacts for Aligned Carbon Nanotubes

被引:0
作者
Huang, Gang [1 ]
Wu, Junhong [2 ]
Li, Haiou [1 ]
Liu, Honggang [2 ,3 ,4 ,5 ]
机构
[1] Guilin Univ Elect Technol, Guangxi Key Lab Precis Nav Technol & Applicat, Guilin 541004, Peoples R China
[2] Beijing Univ Posts & Telecommun, Sch Integrated Circuits, Beijing 100876, Peoples R China
[3] Peking Univ, Ctr Carbon based Elect, Beijing 100871, Peoples R China
[4] Peking Univ, Sch Elect, Beijing 100871, Peoples R China
[5] Peking Univ, Chongqing Inst Carbon Based Integrated Circuits, Chongqing 401332, Peoples R China
关键词
transition metal carbides; contact resistance; aligned carbon nanotube; rapid thermal annealing; Schottky barrier height; RESISTANCE; TRANSISTORS;
D O I
10.3390/nano15100736
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Aligned carbon nanotubes (A-CNTs) are emerging as one of the most promising materials for next-generation nanoelectronics. However, achieving reliable ohmic contacts between A-CNTs and metals remains a critical challenge. In this study, we employ rapid thermal annealing (RTA) to facilitate the formation of transition metal carbides at the metal-CNT interface, significantly reducing contact resistance and enhancing stability. Using the transmission line method (TLM), we demonstrate that RTA reduces the contact resistance at the Ti/A-CNT interface from 112.26 k Omega<middle dot>mu m to 1.57 k Omega<middle dot>mu m and at the Ni/A-CNT interface from 81.72 k Omega<middle dot>mu m to 1.17 k Omega<middle dot>mu m, representing a reduction of over an order of magnitude. Moreover, the Schottky barrier heights (SBHs) for both the Ti/A-CNT and Ni/A-CNT interfaces decreases by approximately 50% after annealing. A comparative analysis with Pd/A-CNT contacts shows that Ti and Ni contacts exhibit superior reliability under harsh conditions. This work provides a viable solution for improving the electrical performance and reliability of CNT-based devices, offering a pathway toward the development of future CMOS technologies.
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页数:10
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