Comprehensive Investigation of the Switching Stability in SiC and GaN Power Devices

被引:1
作者
Tang, Shun-Wei [1 ]
Fan, Chao-Ta [2 ]
Lin, Ming-Cheng [2 ]
Wu, Tian-Li [1 ]
机构
[1] Natl Yang Ming Chiao Tung Univ, Int Coll Semicond, Hsinchu, Taiwan
[2] Device Dynam Lab, Res & Dev Dept, Hsinchu, Taiwan
来源
2022 IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS, IPFA | 2022年
关键词
Switching stability; power devices; dynamic R-dson; zero voltage switching; hard switching; VOLTAGE; HEMTS;
D O I
10.1109/IPFA55383.2022.9915772
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this work, to the best of our knowledge, it is the first time to report the high-frequency switching stabilities ( up to 300kHz) under a 800V of V-ds during hard switching (HSW) and zero voltage switching (ZVS) operations in SiC power devices. The switching dependencies, i.e., temperature, frequency, current, and duty cycle, are evaluated based on the proposed topology, showing the flexible design to effectively investigate the circuit-level switching stability. Furthermore, the high-frequency switching stability in GaN power devices is also evaluated for the comparison, indicating that SiC power device shows a better R-dson stability under ZVS and HSW during the high-frequency switching.
引用
收藏
页数:5
相关论文
共 29 条
[1]   A Generalized Approach to Determine the Switching Lifetime of a GaN FET [J].
Bahl, Sandeep R. ;
Baltazar, Francisco ;
Xie, Yong .
2020 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2020,
[2]  
Bahl SR, 2016, INT RELIAB PHY SYM
[3]   GaN-on-Si Power Technology: Devices and Applications [J].
Chen, Kevin J. ;
Haeberlen, Oliver ;
Lidow, Alex ;
Tsai, Chun Lin ;
Ueda, Tetsuzo ;
Uemoto, Yasuhiro ;
Wu, Yifeng .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (03) :779-795
[4]   200 V GaN-on-SOI Smart Power Platform for Monolithic GaN Power ICs [J].
Cosnier, T. ;
Syshchyk, O. ;
De Jaeger, B. ;
Geens, K. ;
Cingu, D. ;
Fabris, Elena ;
Borga, M. ;
Vohra, A. ;
Zhao, M. ;
Bakeroot, B. ;
Wellekens, D. ;
Magnani, A. ;
Vudumula, P. ;
Chatterjee, U. ;
Langer, R. ;
Decoutere, S. .
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
[5]  
Hoffmann F, 2020, PROC INT SYMP POWER, P533, DOI [10.1109/ISPSD46842.2020.9170150, 10.1109/ispsd46842.2020.9170150]
[6]   Power cycling issues and challenges of SiC-MOSFET power modules in high temperature conditions [J].
Ibrahim, A. ;
Ousten, J. P. ;
Lallemand, R. ;
Khatir, Z. .
MICROELECTRONICS RELIABILITY, 2016, 58 :204-210
[7]  
JEDEC Publication, 2021, JEP182
[8]  
JEDEC Publication, 2021, JEP180.01
[9]   Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges [J].
Jones, Edward A. ;
Wang, Fei ;
Costinett, Daniel .
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2016, 4 (03) :707-719
[10]   Degradation of SiC MOSFETs Under High-Bias Switching Events [J].
Kozak, Joseph P. ;
Zhang, Ruizhe ;
Liu, Jingcun ;
Ngo, Khai D. T. ;
Zhang, Yuhao .
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2022, 10 (05) :5027-5038