Recombination of Copper Tiles connected with Chip Resistors for Wide-Angle Metasurface Absorber

In this paper, a design strategy for a wide-angle metasurface absorber is proposed that evolves a configuration for broadband absorption that consists of four 100 Omega chip resistors and a combination of square copper tiles. To satisfy-10 dB reflectance at all incident angles up to 60 degrees for both transverse electric (TE) and transverse magnetic (TM) polarizations, the copper tiles were recombined. To this end, a transformative genetic algorithm was applied, of which the figure of merit was converted from the original one by multiplying a scaling factor with the worst reflectance in the target band. The simulation results confirmed a-10 dB reflectance ranging from 10.8 to 11.21 GHz, with the fractional bandwidth being 3.73% for both TE and TM polarizations at incident angles ranging from 0 degrees to 60 degrees. The accuracy of the proposed design was verified by conducting measurements, which matched well with the simulated results.