Fabrication of Al8Si0.2Mg secondary aluminum-SiC composite through semi-solid and liquid casting process

被引：0

作者：

Saelee, Sirintip ^{[1
,2
]}

Mahathaninwong, Narissara ^{[3
]}

Janudom, Somjai ^{[1
,2
]}

Chucheep, Thiensak ^{[3
]}

Karrila, Seppo ^{[3
]}

机构：

[1] Prince Songkla Univ, Fac Engn, Dept Min & Mat Engn, Hat Yai 90110, Songkhla, Thailand

[2] Prince Songkla Univ, Ctr Excellence Mat Engn CEME, Hat Yai 90110, Songkhla, Thailand

[3] Prince Songkla Univ, Fac Sci & Ind Technol, Muang,Surat Thani Campus, Surat Thani 84000, Thailand

来源：

MATERIALS RESEARCH EXPRESS | 2025年 / 12卷 / 06期

关键词：

silicon carbide; semi solid slurry; secondary aluminum; aluminum silicon carbide composite; MECHANICAL-PROPERTIES; A356-SICP COMPOSITE; PARTICLES; MICROSTRUCTURE; COST;

D O I：

10.1088/2053-1591/ade11e

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, the microstructure and mechanical properties were investigated of semi-solid slurry Al8Si0.2Mg secondary aluminum alloy mixed with reinforcing SiC particles and prepared with mechanical stirring, and poured in liquid state for gravity casting and squeeze casting. As cast Al8Si0.2Mg-5wt%SiC composite was influenced by squeeze pressure that increased tensile strength by 56% and Brinell hardness by 12.9% from those with gravity casting of the composite. On the other hand, effects of SiC content and added Mg on microstructure and mechanical properties were also investigated. With squeeze casting, adding 1 wt% Mg further increased the tensile strength by 24% and hardness by 18%. The T6 heat treatment tended to increase both tensile strength and hardness. The Al8Si0.2Mg-5wt%SiC composite, with 1 wt%Mg added, squeeze cast, and subjected to T6 heat treatment, showed the greatest tensile strength of 290 MPa and Brinell hardness of 130 HB.

引用

页数：16

共 40 条

[1]

Abdrrazak H., 2011, Silicon Carbide: Synthesis and Properties Properties and Applications of Silicon Carbide, DOI [10.5772/15736, DOI 10.5772/15736]

[2] Wear Properties of A356/Al2O3 Metal Matrix Composites Produced by Semisolid Processing [J].