Fully 3D Printed Capacitive Bending Sensor Enabled by 3D Structuring

被引:0
作者
van Dommelen, Ryan [1 ]
Briand, Danick [1 ]
机构
[1] Ecole Polytech Fed Lausanne EPFL, Soft Transducers Lab LMTS, Rue Maladiere 71b, CH-2000 Neuchatel, Switzerland
关键词
3D printing; 3D structured electronics; asymmetric bending sensor; capacitive motion sensor; direct ink writing; STRAIN SENSORS; CHALLENGES;
D O I
10.1002/admt.202401431
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Advancing 3D printing fabrication methodologies can enable customized wearables and robotic sensing systems with novel sensing architectures, tuned mechanical properties, and higher feature density. In this work, a design and fabrication approach is developed and used to produce a novel soft elastomeric capacitive sensor conceived to measure bending motions. Analytical and finite element modeling are used to create a non-intrusive sensor design that can measure the bending angle of a joint independent of bending direction. Transduction is achieved by 3D printed angular features, with integrated silver plates, fabricated by Direct Ink Writing (DIW) a shear thinning UV-curable silicone ink. The soft sensor achieves a sensitivity of 2.50 +/- 0.04 fF/degrees and detects the bending direction, matching the developed model. This work makes a significant contribution to the fabrication of fully 3D-printed soft electronics, enabling devices with novel architectures and functionalities.
引用
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页数:12
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