Quantum Co-packaged Optical Assembly

被引：0

作者：

Meek, Andrew ^{[1
]}

Lee, Bernard H. L. ^{[2
]}

Chen, Yang ^{[3
]}

Vallance, R. Ryan ^{[3
]}

O'Farrell, Michael ^{[1
]}

Bhatti, Abu Bakar ^{[1
]}

Ferguson, Robert ^{[4
]}

Fatadin, Irshaad ^{[4
]}

Pitwon, Richard ^{[5
]}

机构：

[1] Senko Adv Components Ltd, Basingstoke, Hants, England

[2] Senko Adv Components Ltd, Hong Kong, Peoples R China

[3] Senko Adv Components, Camarillo, CA USA

[4] Natl Phys Lab, Teddington, Middx, England

[5] Resolute Photon Ltd, Larkinstown, Ireland

来源：

2024 13TH IEEE CPMT SYMPOSIUM JAPAN, ICSJ 2024 | 2024年

基金：

“创新英国”项目;

关键词：

photonic integrated circuit; optical connector; fiber-to-PIC coupler; silicon photonics; optical transceiver;

D O I：

10.1109/ICSJ62869.2024.10804742

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Packaging of QPICs requires low-loss coupling between fiber arrays and PICs. As QPICs typically operate on entangled or single photons, coupling is more critical than for conventional PICs, in which thousands of photons are manipulated at a time. In this paper we will report on the results from the UK government funded projects, in which a novel metallic aspherical micro-mirror array unit was coupled for the first time to a QPIC. The micro-mirror array is formed in a stamping process allowing it to be produced in high-volume and it can be deployed in diverse environments including high temperature or cryogenic environments.

引用

页码：53 / 56

页数：4

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