Wetting of 430ss by molten PbO-B2O3-Bi2O3-CuO glass

In this work, a low melting point glass solder was prepared by using the dust waste with lead content of about 30 wt% from a metallurgical plant through formula optimization, aiming at recycling the waste and reducing environmental pollution. The glass solder is mainly composed of PbO-2 degrees 3-B2 degrees 3-CuO, which has a glass transition temperature of 286.3 degrees C (Tg), a crystallization temperature of 428.4 degrees C (Tc), a complete fusion temperature of 490.3 degrees C (Tm), a thermal expansion coefficient of 1.10x10-5 /degrees C (from room temperature to Tg), and surface tension lv = 217.58-0.78(T-Tm) mN/m (from Tm to 530 degrees C). In the experiment, the wettability and spreading dynamics of 430ss by molten glass melt were studied by traditional and improved sessile drop method. The results show that the good wettability, and the contact angle can be as low as 4.7 degrees, and the spreading process is mainly determined by the interface reaction and the viscosity of melt. In addition, the thermal expansion coefficient of glass solder is close to that of 430ss, which is suitable for sealing applications. This work provides basic physical property data for glass solders suitable for 430ss sealing, and provides experience for the development of new glass solders.