High-temperature-resistant thin-film sensors can quickly and accurately obtain signals such as temperature, heat flux, and strain from surfaces in high-temperature applications, and the reliability of the sensors is determined by the quality of the lead electrical connection structure of the high-temperature-resistant thin-film sensors. Aiming at the challenges of complicated process and high cost of the lead electrical connection structure of high temperature resistant thin-film sensors, a lead electrical connection structure is proposed based on polymer-derived ceramics (PDC). The lead connector was prepared using a high-temperature wire and polymer-derived ceramics, and then the lead connector and the lead film were sintered together by PDC paste to obtain the electrical connection between the lead film and the high-temperature wire. The surface morphology and electrical properties as well as the high-temperature stability of the lead connector were characterized, and the proposed lead electrical connection structure was also used for polymer-derived ceramic thin-film thermistors, and multiple rounds of resistance temperature tests were conducted from room temperature to 800 degrees C. The results show that the lead connector has an oxide layer on the surface and a conductive layer on the inside, and the structure can withstand temperatures up to 1100 degrees C with good high-temperature stability, which makes it possible to be used for high-temperature-resistant polymer-derived ceramic thin-film sensors. A low-cost and simple process hightemperature lead electrical connection structure is provided for high-temperature-resistant thin-film sensors.