Molecular dynamics study on the effects of cuboid nanostructure on the distribution of local thermal resistance at a solid-liquid interface

被引:0
作者
Omori, Takuto [1 ]
Shibahara, Masahiko [1 ]
机构
[1] Osaka Univ, Grad Sch Engn, Dept Mech Engn, 2-1 Yamadaoka, Suita, Osaka 5650871, Japan
基金
日本学术振兴会;
关键词
Molecular dynamics; Interfacial thermal resistance; Solid-liquid interface; Nanostructure; SURFACE; WATER;
D O I
10.1016/j.ijthermalsci.2025.109949
中图分类号
O414.1 [热力学];
学科分类号
摘要
This study focuses on thermal transport at the interface between solid and liquid with various cuboid nanostructure systems. We calculated the solid-liquid interfacial thermal resistance (ITR) and the distribution of local ITRs with a 0.2 nm spatial resolution. The results were obtained using non-equilibrium molecular dynamics. Applying a thermal circuit model, we computed the thermal resistance by combining the local ITRs. Also, we introduced spectral analysis to explain the distribution of local ITR magnitudes. As a result, we found that the local ITRs decreased at the top corner of the nanostructure and increased at its base. The thermal transport at the top corner contributed significantly to the total thermal transport at the solid-liquid interface. It was revealed that the ratio of the overall ITR to the combined local ITRs agreed with the ratio of the area of a flat surface to the area along the lower wall and the nanostructure, including the Cassie-Baxter state, only when the local temperature jumps around the interface are closely similar i.e. the interaction strength between solid and liquid is not extremely high. Moreover, from spectral analysis of solid atoms, we found that the vibrational density of states (VDOS) and the spectral heat flux of the solid atoms at the top corner of the nanostructure peaked in a low-frequency range and the VDOS overlap became higher at the top corner in all cases. This strong vibrational coupling is another factor contributing to the lowest local ITR at the top corner of the nanostructure.
引用
收藏
页数:12
相关论文
共 39 条
[1]   Role of Underlying Substrates on the Interfacial Thermal Transport in Supported Graphene Nanochannels: Implications of Thermal Translucency [J].
Becerra, Diego ;
Walther, Jens H. ;
Zambrano, Harvey A. .
NANO LETTERS, 2024, 24 (39) :12054-12061
[2]   The effects of deviations from Lorentz-Berthelot rules on the properties of a simple mixture [J].
Boda, Dezsoe ;
Henderson, Douglas .
MOLECULAR PHYSICS, 2008, 106 (20) :2367-2370
[3]   Nanoscale thermal transport [J].
Cahill, DG ;
Ford, WK ;
Goodson, KE ;
Mahan, GD ;
Majumdar, A ;
Maris, HJ ;
Merlin, R ;
Phillpot, SR .
JOURNAL OF APPLIED PHYSICS, 2003, 93 (02) :793-818
[4]   Experimental investigation of microchannel coolers for the high heat flux thermal management of GaN-on-SiC semiconductor devices [J].
Calame, J. P. ;
Myers, R. E. ;
Binarl, S. C. ;
Wood, F. N. ;
Garven, M. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2007, 50 (23-24) :4767-4779
[5]   Optimizing the heat source layout of chips using bionic method: Reduction of junction temperature [J].
Dang, Hao ;
Zhang, Qian ;
Lu, Yang ;
Zhang, Xiu ;
Ma, Weigang ;
Zhang, Xing .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2022, 197
[6]   Unraveling the Regimes of Interfacial Thermal Conductance at a Solid/Liquid Interface [J].
El-Rifai, Abdullah ;
Perumanath, Sreehari ;
Borg, Matthew K. ;
Pillai, Rohit .
JOURNAL OF PHYSICAL CHEMISTRY C, 2024, 128 (20) :8408-8417
[7]   3-D-Lumped Thermal Network Models for the Reliability Analysis of Fan-Cooled Plate-Fin Heatsink [J].
Fu, Heping ;
Chen, Jie ;
Wang, Hui ;
Liu, Zhigang ;
Sorensen, Henrik ;
Bahman, Amir Sajjad .
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2023, 11 (03) :3480-3491
[8]  
Fujiwara K., 2022, 7 THERM FLUIDS ENG C, P399, DOI [10.1615/TFEC2022.emt.041157, DOI 10.1615/TFEC2022.EMT.041157]
[9]   Atomic-scale thermal manipulation with adsorbed atoms on a solid surface at a liquid-solid interface [J].
Fujiwara, Kunio ;
Shibahara, Masahiko .
SCIENTIFIC REPORTS, 2019, 9 (1)
[10]   Molecular dynamics simulation of thermal conduction across mechanical interfaces with sub-nm roughness [J].
Gao, Ben ;
Zou, Ziwen ;
Li, Menglin ;
Hao, Menglong .
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2024, 156