Stencil printing procedure using transient three-dimensional computational fluid dynamics

被引：0

作者：

Kim, Hyeongtae ^{[1
]}

Mohammadhosseinzadeh, Majid ^{[1
]}

Jung, Myung Keun ^{[2
]}

Na, Seung Ryul ^{[2
]}

Kang, Namhyun ^{[3
]}

Kim, Ji Hoon ^{[1
]}

机构：

[1] Pusan Natl Univ, Sch Mech Engn, Busan, South Korea

[2] LG Innotek, Seoul, South Korea

[3] Pusan Natl Univ, Sch Mat Sci & Engn, Busan, South Korea

来源：

JOURNAL OF MANUFACTURING PROCESSES | 2025年 / 148卷

基金：

新加坡国家研究基金会;

关键词：

Surface mount technology; Non-Newtonian fluid behaviour; Computational fluid dynamics; Transient modelling; SOLDER PASTE; RHEOLOGY;

D O I：

10.1016/j.jmapro.2025.05.025

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, a numerical analysis method for the stencil printing process is proposed to enhance accuracy while minimising computational cost. A volume of fluid two-phase analysis using computational fluid dynamics was utilised for simulation. The rheological behaviours of the solder paste were measured and the Cross viscosity model, which accounts for shear thinning was used for fitting the data. The simulation procedure was divided into solder roll simulation and solder filling simulation. First, a 2D solder roll simulation was performed by employing solder paste movement from the edge of the plate to the pads of the printed circuit board. Then, solder filling simulation was performed to investigate the filling of the solder paste in the aperture, considering geometrical variations caused by warpage. An "air pocket" was generated during solder rolling simulation, which lowered the pressure of the solder paste. The solder paste pressure obtained by the solder roll simulation provided better accuracy in the simulation results compared to filling simulation only by an assumed pressure. In addition, the effects of the angle and velocity of the squeegee were investigated. For validation, the calculated volume-filling ratio results were compared with the measurements, demonstrating improved accuracy over previously suggested simulation methods.

引用

页码：306 / 316

页数：11

共 24 条

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