Plasma-enhanced chemical vapor deposition of SiO2 films at 400 kHz and 100 °C using tetraethyl orthosilicate with oxygen and SiH4 with nitrous oxide

被引：0

作者：

Kusuda, Yutaka ^{[1
,2
]}

Asai, Yuki ^{[2
]}

Miyashita, Takahiro ^{[2
]}

Nishinaka, Hiroyuki ^{[3
]}

机构：

[1] Department of Electronics, Kyoto Institute of Technology, Sakyo, Kyoto

[2] Research and Development Department, Samco Inc., Fushimi, Kyoto

[3] Faculty of Electrical Engineering and Electronics, Kyoto Institute of Technology, Sakyo, Kyoto

来源：

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 2025年 / 64卷 / 04期

关键词：

Electron resonance - Electron spin resonance spectroscopy - Nitrogen oxides - Organoclay - Photodissociation - Photoionization - Plasma CVD - Silica - Silicon oxides;

D O I：

10.35848/1347-4065/adc1d3

中图分类号：

学科分类号：

摘要：

This study investigated various properties of SiO2 films deposited using SiH4 and tetraethyl orthosilicate (TEOS) at a frequency of 400 kHz in plasma-enhanced chemical vapor deposition (PECVD) at 100 °C. The TEOS-SiO2 film exhibited a higher refractive index and density than the SiH4-SiO2 film. Electron spin resonance measurements at −180 °C revealed fewer structural defects in TEOS-SiO2, while atomic force microscopy showed smoother surface morphology in TEOS-SiO2 compared to SiH4-SiO2. These differences are attributed to the surface-mediated growth mechanism of TEOS compared to the gas-phase-dominated reactions of SiH4. These results demonstrate that TEOS-PECVD at 400 kHz is a promising technique for forming high-quality SiO2 films at low temperatures. © 2025 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.

引用

共 35 条

[1]

Stoppa M., Chiolerio A., Sensors, 14, (2014)

[2]

Amjadi M., Kyung K.-U., Park I., Sitti M., Adv. Funct. Mater, 26, (2016)

[3]

Wang C., Dong H., Jiang L., Hu W., Chem. Soc. Rev, 47, (2018)

[4]

Greiner M. T., Lu Z.-H., NPG Asia Mater, 5, (2013)

[5]

Ostroverkhova O., Chem. Rev, 116, (2016)

[6]

Zardetto V., Brown T. M., Reale A., Carlo A. D., J. Polym. Sci. B: Polym. Phys, 49, (2011)

[7]

Ling H., Liu S., Zheng Z., Yan F., Small Methods, 2

[8]

MacDonald W. A., Looney M. K., MacKerron D., Eveson R., Adam R., Hashimoto K., Rakos K., J. Soc. Inf. Disp, 15, (2007)

[9]

Joshi P. C., Voutsas A. T., Hartzell J. W., ECS Trans, 35, (2011)

[10]

Guan D., Bruccoleri A. R., Heilmann R. K., Schattenburg M. L., J. Micromech. Microeng, 24, (2014)

← 1 2 3 4 →