Preparation and Modification of Sucrose-Based Non-Isocyanate Polyurethane Adhesives for Plywood Bonding

被引:0
作者
Zhong, Hongyi [1 ]
Zhang, Qianyu [1 ]
Lei, Hong [2 ]
Zhou, Xiaojian [1 ]
Zhang, Jun [1 ]
Du, Guanben [1 ]
Pizzi, Antonio [3 ]
Xi, Xuedong [1 ]
机构
[1] Southwest Forestry Univ, Coll Mat Sci & Chem Engn, Yunnan Key Lab Wood Adhes & Glued Prod, Kunming 650224, Peoples R China
[2] Zhejiang A&F Univ, Sch Chem & Mat Engn, Hangzhou 311300, Peoples R China
[3] Univ Lorraine, LERMAB, F-88000 Epinal, France
来源
MOLECULES | 2025年 / 30卷 / 07期
基金
中国国家自然科学基金;
关键词
biomass adhesive; NIPU; sucrose; bonding strength; WOOD ADHESIVES; CITRIC-ACID; GREEN; REACTIVITY; VISCOSITY; CHEMISTRY;
D O I
10.3390/molecules30071541
中图分类号
Q5 [生物化学]; Q7 [分子生物学];
学科分类号
071010 ; 081704 ;
摘要
The production of non-isocyanate polyurethane (NIPU) resins using recyclable biomass materials and no isocyanates as a substitute for traditional polyurethane (PU) materials has become a research focus in the polyurethane industry. The development of such NIPU resins for application as wood adhesives has also emerged as an interesting new research topic. In this study, sucrose was used to react with dimethyl carbonate, and then polymerized with an amine to prepare sucrose-based non-isocyanate polyurethane (SNIPU) adhesives and evaluate their suitability for use in plywood. Four amines, namely polyethylene amine (PEI) of molecular weight (MW) 10,000, PEI of MW 1800, diethylenetriamine, and hexanediamine were tested in the preparation of SNIPU adhesives to determine a more suitable amine showing optimal adhesion performance. The effect of the amount of the amine added on adhesive properties was further investigated. The results showed that the SNIPU adhesive prepared with PEI-10000 as amine presents a good bonding performance. The SNIPU prepared with a PEI-10000 content of 45% (w/w on sucrose) presented the highest bonding strength. The dry strength, 24 h cold water (23 degrees C) wet strength, and 3 h hot water (63 degrees C and 93 degrees C) wet strengths of its bonded plywood were 1.26 MPa, 0.90 MPa, 0.84 MPa, and 0.80 MPa, respectively. Furthermore, the addition of 13% (w/w on SNIPU adhesive) of ethylene glycol diglycidyl ether (EGDE) as a modifier showed a significant decrease of 20 degrees C of the curing temperature of the SNIPU adhesive.
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页数:12
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