Fabrication and characterization of interdigital transducer structures as temperature sensors by two-photon lithography

Continuous developments in the field of 3D printing techniques and equipment have enabled their usage in the field of electronics structures, circuits, and device fabrication in addition to many other fields. This advancement has enabled the potential fabrication of sensors using silicon-based micro or even Nanoelectronics. Currently, the manufacturing and packaging of such devices and structures are heavily reliant on lithography, which can be slow and can involve substantial processing requirements. In this paper, a temperature-sensing Interdigital Transducer (IDT) structure was designed and fabricated using Direct Laser Writing (DLW) based on Two-Photon Lithography (TPL), which is a high-resolution 3D printing technology. The TPL in a positive photoresist was combined with the physical vapor deposition method and the lift-off process to create gold IDT microstructures. The developed sensing structures were characterized using a network analyzer to determine the resonance frequency and its dependence on the temperature changes. The results showed that the IDT structures exhibit a linear response toward the changes in temperature with an average sensitivity of 0.123 MHz/degrees C. The most important advantage in producing the IDT structure with the additive manufacturing technique is that a very small-sized structure is produced error-free and efficiently.