A topology optimization method for managing transient thermal and vibration effects with eigenvalues and steady-state constraints

被引:0
作者
Onodera, Shuya [1 ,2 ]
Yamada, Takayuki [1 ,3 ]
机构
[1] Univ Tokyo, Grad Sch Engn, Dept Mech Engn, Yayoi 2-11-16,Bunkyo ku, Tokyo 1138656, Japan
[2] AGC Inc, Suehiro Cho 1-1,Tsurumi Ku, Yokohama, Kanagawa 2300045, Japan
[3] Univ Tokyo, Inst Engn Innovat, Grad Sch Engn, Dept Strateg Studies, Yayoi 2-11-16,Bunkyo ku, Tokyo 1138656, Japan
关键词
Optimal design; Topology optimization; Transient heat transfer; Thermal eigenvalue; Thermo-mechanical problem; HEAT-CONDUCTION; SENSITIVITY-ANALYSIS; STRUCTURAL OPTIMIZATION; BATTERY PACK; SOLID BODY; DESIGN; TEMPERATURE; REDUCTION; LAPLACIAN;
D O I
10.1016/j.ijheatmasstransfer.2025.127083
中图分类号
O414.1 [热力学];
学科分类号
摘要
This paper presents a topology optimization method for the effective control of transient thermal conduction and vibration responses using eigenvalues and steady-state temperatures. Designing thermally efficient devices with transient responses, such as battery housings, is crucial for maximize operational efficiency. Eigenvalues were used to approximate the response, reducing the computational cost associated with the transient response in the optimization process. The objective functionals were evaluated using the weighted sum method. Maximum temperature constraints were incorporated into the eigenvalue problem by considering the steadystate temperature distribution. This study employed finite element analysis to solve the eigenvalue problems concerning vibration and heat transfer effects and to update the level-set functions. The effectiveness of this method was demonstrated by implementing two-and three-dimensional numerical examples, in which the thermal response was improved by maximizing the thermal eigenvalues, and the effects of thermoelasticity on the thermally efficient structures.
引用
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页数:19
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