Ta-based Au-free and low annealing temperature ohmic contacts on GaN and AlGaN/GaN heterostructures

被引:0
作者
Xia, Songyuan [1 ,2 ]
Zhang, Yumin [1 ,3 ]
Sun, Yuanhang [1 ]
Zhu, Qizhi [1 ]
Liu, Wei [1 ]
Wang, Jianfeng [1 ,3 ]
Xu, Ke [1 ,2 ,3 ]
机构
[1] Chinese Acad Sci, Suzhou Inst Nanotech & Nanobion, Suzhou, Peoples R China
[2] ShanghaiTech Univ, Sch Phys Sci & Technol, Shanghai 201210, Peoples R China
[3] Suzhou Nanowin Sci & Technol Co Ltd, Suzhou, Peoples R China
基金
中国国家自然科学基金;
关键词
GaN; Ohmic contact; Ta; Low temperature;
D O I
10.1016/j.matlet.2025.138473
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Ta-based ohmic contacts on GaN and AlGaN/GaN heterostructures were investigated. The main advantage of the Ta-based ohmic contacts is the low annealing temperature, with the optimal range identified as 550---600 degrees C. Notably, the root-mean-square roughness of Ta-based contacts is 8.0 nm, far less than the 22.4 nm in Ti-based contacts. Additionally, the transport properties were also investigated through temperature-dependent I-V measurements, where field emission is the predominant mechanism on GaN while thermionic filed emission play a major role on AlGaN/GaN.
引用
收藏
页数:4
相关论文
共 50 条
  • [21] Performance Comparison of Au-Based and Au-Free AlGaN/GaN HEMT on Silicon
    Niranjan, S.
    Rao, Ankit
    Muralidharan, R.
    Sen, Prosenjit
    Nath, Digbijoy N.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (03) : 1014 - 1019
  • [22] Microanalysis of the Ti/Al and Ti/Al/Mo/Au ohmic contacts metallization to AlGaN/GaN heterostructures
    Macherzynski, Wojciech
    Stafiniak, Andrzej
    Paszkiewicz, Bogdan
    Gryglewicz, Jacek
    Paszkiewicz, Regina
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2016, 213 (05): : 1145 - 1149
  • [23] Comparative study of Ti/Al and Ti/Al/Ti/Au ohmic contacts to AlGaN/ GaN heterostructures
    Canbolat, Ayse
    Akkaya, Abdullah
    Ayyildiz, Enise
    MATERIALS LETTERS, 2024, 376
  • [24] Morphological and electrical comparison of Ti and Ta based ohmic contacts for AlGaN/GaN-on-SiC HFETs
    Pooth, A.
    Bergsten, J.
    Rorsman, N.
    Hirshy, H.
    Perks, R.
    Tasker, P.
    Martin, T.
    Webster, Rf.
    Cherns, D.
    Uren, M. J.
    Kuball, M.
    MICROELECTRONICS RELIABILITY, 2017, 68 : 2 - 4
  • [25] Ta-based barrier layer of ohmic interconnects for highly reliable GaN HEMTs
    Kamada, Yoichi
    Okamoto, Naoya
    Ohki, Toshihiro
    Kanamura, Masahito
    Masuda, Satoshi
    Imanishi, Kenji
    Shigematsu, Hisao
    Kikkawa, Toshihide
    Hara, Naoki
    Joshin, Kazukiyo
    PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 8, NO 7-8, 2011, 8 (7-8): : 2197 - 2199
  • [26] Analysis of the ohmic contacts of Ti/Al/Ni/Au to AlGaN/GaN HEMTs by the multi-step annealing process
    颜伟
    张仁平
    杜彦东
    韩伟华
    杨富华
    半导体学报, 2012, 33 (06) : 31 - 36
  • [27] Ti/Al ohmic contacts on AlGaN/GaN heterostructures with different defect density
    Greco, Giuseppe
    Iucolano, Ferdinando
    Bongiorno, Corrado
    Giannazzo, Filippo
    Krysko, Marcin
    Leszczynski, Mike
    Roccaforte, Fabrizio
    APPLIED SURFACE SCIENCE, 2014, 314 : 546 - 551
  • [28] Analysis of the ohmic contacts of Ti/Al/Ni/Au to AlGaN/GaN HEMTs by the multi-step annealing process
    Yan Wei
    Zhang Renping
    Du Yandong
    Han Weihua
    Yang Fuhua
    JOURNAL OF SEMICONDUCTORS, 2012, 33 (06)
  • [29] From Schottky to Ohmic graphene contacts to AlGaN/GaN heterostructures: Role of the AlGaN layer microstructure
    Fisichella, G.
    Greco, G.
    Roccaforte, F.
    Giannazzo, F.
    APPLIED PHYSICS LETTERS, 2014, 105 (06)
  • [30] Scandium-Based Ohmic Contacts to InAIN/GaN Heterostructures on Silicon
    Charan, Vanjari Sai
    Vura, Sandeep
    Muralidharan, R.
    Raghavan, Srinivasan
    Nath, Digbijoy N.
    IEEE ELECTRON DEVICE LETTERS, 2021, 42 (04) : 497 - 500