Enhanced material removal modeling in cylindrical bonnet tool polishing: Incorporating time-dependent pad wear effects

To enhance the accuracy and stability of the material removal model for cylindrical bonnet tool polishing (CBTP), this study introduces a model incorporating the time-varying wear effect of the polishing pad. Initially, the functional principles of the CBTP method are systematically outlined. An advanced material removal model is then proposed, which accounts for the impact of pad wear on pressure and velocity distributions within the contact area. Experimental methods were employed to explore how pad wear affects the pad surface morphology, polishing quality, and material removal rates. Findings reveal that pad wear considerably influences both the depth of material removal and the quality of the polished surface. Validation experiments demonstrate that the enhanced model is accurate and stable. Including the time-varying factor, the discrepancy between the predicted and experimental values of the polishing spot size was 9.29 %, while the accuracy of the predicted material removal depth reached 90.74 %. Additionally, the removal profiles generated by the improved model closely matched those observed experimentally.