Thermal-mechanical-electrical coupling isogeometric analysis for piezoelectric material structures

被引：1
|
作者：
Zhang, Zhong [1 ]
Zhou, Liming [1 ]
Pei, Chunyan [1 ]
机构：
[1] Jilin Univ, Sch Mech & Aerosp Engn, Nation Key Lab Automot Chassis Integrat & Bion, Changchun 130025, Jilin, Peoples R China
来源：
MECHANICS OF ADVANCED MATERIALS AND STRUCTURES | 2024年
关键词：
Isogeometric analysis; non uniform rational B-spine; piezoelectric materials; thermal-mechanical-electro coupling; thermal environment; FINITE-ELEMENT-METHOD; WAVE-PROPAGATION; DYNAMIC-ANALYSIS; REFINEMENT; BEAMS; NURBS; COEFFICIENTS; VIBRATION; SURFACE; SHELLS;
D O I：
10.1080/15376494.2024.2379505
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
To solve the multi-physical coupling characteristics of piezoelectric structures, the thermal-mechanical-electrical coupling isogeometric analysis method (TMEC-IGA) is proposed to explore the structures of piezoelectric materials. Based on the basic equations and boundary conditions of piezoelectric materials, NURBS basis function is introduced to construct displacement and electrical potential functions, and the control equation of TMEC-IGA is derived. Numerical examples show that TMEC-IGA is effective in solving the thermal-mechanical-electro coupling problem of piezoelectric structures, and has broad application prospects in the design, development and performance analysis of piezoelectric devices.
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页数：17
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