Thermal-mechanical-electrical coupling isogeometric analysis for piezoelectric material structures

To solve the multi-physical coupling characteristics of piezoelectric structures, the thermal-mechanical-electrical coupling isogeometric analysis method (TMEC-IGA) is proposed to explore the structures of piezoelectric materials. Based on the basic equations and boundary conditions of piezoelectric materials, NURBS basis function is introduced to construct displacement and electrical potential functions, and the control equation of TMEC-IGA is derived. Numerical examples show that TMEC-IGA is effective in solving the thermal-mechanical-electro coupling problem of piezoelectric structures, and has broad application prospects in the design, development and performance analysis of piezoelectric devices.