An Advanced Packaging Figure of Merit (AP-FoM) for Benchmarking of Heterogeneous Integration Technologies

A novel advanced packaging figure of merit (AP-FoM) for benchmarking of heterogeneous integration technology performance is proposed in this paper. The AP-FoM is composed of eye width, RC time and jitter in equation of [Eye width / (RC time*Jitter)], related to the electrical characteristics of packaging interconnect, unlike conventional FoM (c-FoM) using bandwidth density and power efficiency in [(Bandwidth / Shoreline) / (Energy / bit)], more related to protocols. The AP-FoM is used to judge the performance of CoWoS-R organic interposer and CoWoS-S silicon interposer, respectively, under the protocols of UCIe and HBM3E both. The signal integrity (SI) performances are simulated on both technologies and the data are used in the AP-FoM to calculate the performance. The results show the AP-FoM can help judge the technology difference effectively and help design interconnect metal scheme for better performance. Other figure of merit, such as routability or cost, will be investigated in the future.