Microstructure and thermal conductivity of short carbon fiber/Al composites with nickel-coated carbon fibers consolidated by vacuum hot pressing for electronic packaging applications

Short carbon fiber reinforced aluminum matrix composites exhibit suitable thermal conductivity and desirable coefficient of thermal expansion for electronic packaging applications. The interfacial bonding characteristics between carbon fibers and aluminum matrix play a crucial role in determining the performance of the composites. In the present study, the surface modification of carbon fibers and optimization of fabrication processing parameters were used to ameliorate the interface bonding and improve the properties of carbon fiber/Al composites. The electroless plating method was employed to deposit a nickel coating on the surface of carbon fibers. Aluminum matrix composites reinforced with 20 similar to 50 vol.% uncoated or nickel-coated carbon fibers were fabricated by vacuum hot pressing technique. The microstructures, interface structures, relative density and thermal conductivity of the composites were systematically investigated. The results indicated that carbon fiber/Al composites with relatively high density of 98.9% and acceptable thermal conductivity of 218.1 W<middle dot>m-1 K-1, as potential candidates for electronic packaging applications, were successfully fabricated. Through the application of nickel coating, the interfacial thermal resistance was effectively reduced by one order of magnitude derived from the experimental calculations using Maxwell-Garnett effective medium approach as a result of improved interface bonding.